Non-Destructive Bond Pull and Ball Shear Failure Analysis Based on Real Structural Properties

Abtract: Bond pull testing, a well-known method in the failure analysis community, is used to evaluate the integrity of an electronic microchip as well as to detect counterfeit ICs. Existing bond pull tests require that the microchip be de-capsulated in order to obtain physical access to the bond wires in the IC package. Bond pull analysis based on simulation and finite element methods also exists but relies on the original model for a bond wire from a CAD design. In this work, we introduce X-ray tomography imaging with 700nm imaging resolution to acquire the 3D geometry details of bond wires non-destructively. Such information can be used to develop more accurate models for finite element analysis based on real size and structure. Therefore, one can test the bond wire strength as a proof of concept for virtual mechanical testing and counterfeit detection in microchips.